Wafer Processing Engineer - Summer Internship

Research Triangle, North Carolina, United States · Process Engineering

Description

Micross Advanced Interconnect Technology is seeking a knowledgeable, self-motivated physical science or engineering student for an internship with our Process Engineering team. The internship will require extensive hands-on wafer processing in our cleanroom facilities with the successful candidate performing any of the following: wet processing, thin film depositions (sputter, e-beam, and/or PECVD), dry etching, and electroplating. The successful candidate should have some knowledge of wafer processes and basic device processing steps. Experience with material characterization, metrology measurements, data recording, and data presentation/summation is a plus.


Other Duties & Responsibilities:

Requirements


Due to Micross AIT’s business and ITAR-registration status, successful candidates must be US citizens or US permanent resident.

Benefits

If you are interested in gaining valuable semiconductor processing experience, working in a dynamic, back-end-of-line wafer processing facility focused on advanced packaging and interconnect technologies, please apply.

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