3D Heterogeneous Integration Principal Investigator (Semiconductors)

Durham, North Carolina, United States


This position will support the Micross 3D Heterogeneous Integration program areas, including:

Primary responsibilities of this member of the engineering staff are to lead and support technology development projects in the form of customer interaction and day-to-day project management to ensure customer deliverables and internal development project deliverables are successful and remain on schedule. The position responsibilities include program and process development, building process flows & lot travelers, lot management & engineering support, as well as leading proposals or providing budgetary input on bids/proposals, and technical support to Program Managers on large proposals. Duties may include overseeing development of photolithographic processing, wet processing, dry etching, thin film deposition, electroplating, and die assembly processes. The successful candidate will have a strong background in back-end-of-the-line (BEOL) semiconductor processing (e.g. MEMS or other post-CMOS processing). Experience in advanced packaging and/or 3D integration processes is desired.

Essential Duties & Responsibilities:

Other Duties & Responsibilities:


Job Qualifications:

Job Skills:

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