3D Heterogeneous Integration Process Engineer (Semiconductor Processing)

Durham, North Carolina, United States


We are seeking a knowledgeable, self-motivated engineer for our growing 3D Heterogeneous Integration (3DHI) program needs. This position will focus on supporting 3DHI processing and process development, for, but not limited to, silicon interposer fabrication, through silicon via (TSV) fabrication, wafer bumping and micro-bumping, package assembly, and integrating a combination of interconnect technologies together. The successful candidate will have a wide knowledge of wafer processing technologies, including thin film material deposition of metals, spin-on resists and polymers, photolithography, and wet chemical processes. This position will support both technical and scheduling management tasks for new and existing customer needs including hands-on processing, task management, and lot management.

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