Process Engineer I (2nd Shift)

Durham, North Carolina, United States


We are seeking a knowledgeable, self-motivated engineer for our growing 3D Heterogeneous Integration (3DHI), WLP, and CGA program needs. This position will focus on supporting advanced packaging processing and process development, for, but not limited to, silicon interposer fabrication, through silicon via (TSV) fabrication, wafer bumping and micro-bumping, package assembly, column grid array (CGA) and integrating a combination of interconnect technologies together. The successful candidate will have a working knowledge of wafer processing technologies, including thin film material deposition of metals, spin-on resists and polymers, photolithography, and wet chemical processes. This position will support both technical and scheduling management tasks for new and existing customer needs, which includes hands-on processing, task management, and potentially lot management. 2nd shift position.


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Pay commensurate with experience

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