Engineering Intern - 3D Heterogeneous Integration

Durham, North Carolina, United States



The internship will initially focus on supporting through-Si Via (TSV) integration process enhancements, including, but not limited to TSV liners, barrier layers, metallization, and plating. Future focus for this position may include thin film deposition and wafer processing for novel MEMS-like device structures. This position will support internally and externally funded development projects.

Essential Duties & Responsibilities:

Hands-on engineering resource for integration process enhancements.

Participate and conduct process improvement experiments, accurately recording and reporting data

Employ standard troubleshooting protocols

Other Duties & Responsibilities:

Comply with all safety policies, practices and procedures.

Comply with all quality and ITAR policies, practices and procedures.

Build meaningful and productive relationships with internal business partners.

Participate in proactive team efforts to achieve departmental and company goals.

Contribute to building a positive team spirit.

Communicate effectively with all levels of employees.

Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.

Maintain the highest degree of honesty and integrity at all times.

Perform other duties as assigned.


Job Qualifications:

US citizenship or permanent resident alien status is required.

B.S in physical science or engineering and working toward an advanced degree (MS or PhD)

Knowledge of wafer processes and basic device processing, with a good background in thin film deposition.

Overall experience with metrology measurements, data recording, and data presentation (PowerPoint) is a plus.

Job Skills:

Excellent written and verbal communication skills


Great work environment, opportunity to work in a state-of-the art facility with a great team!

Salary and benefits commensurate with qualifications and experience.

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